Technologies we use include:

• LPCVD deposition of polysilicon, silicon nitride (stochiometric and low-stress), TEOS
• Thermal oxidation
• Ion implantation
• Photolithography
• Thin film evaporation and sputtering of metals and insulators
• Wet etching of silicon, glass, metals etc.
• Deep reactive ion etching (DRIE)
• PECVD depositions of silicon oxides and silicon nitrides
• Photosensitive polymers (e.g. polyimide)
• Wafer bonding and wafer dicing
   

Over the past years we have designed and fabricated a broad spectrum of chips for customers operating in very diverse markets, such as medical diagnostics, environmental monitoring, semiconductor industry, hard disk manufacturing, TEM analysis, high resolution acoustic imaging, micro particle fabrication, chemical industry and more.
 

Solutions based on MEMS and Microtechnology:
 

Membrane structures

• Thermal flow sensors based on
• Capacitive micromachined ultrasonic transducers (CMUTs) for acoustical imaging
• Ultra-thin 8nm (World Record) TEM grids 
   

Through wafer etching

• Ion mobility spectrometer
• Micro and nano sieves allow for high throughput micro and nano particle generation 
   

More complex MEMS structures

• Structures with burried channels such as a mass flow sensors based on the Coriolis force
• Different types of Scanning Probe Microscopy (SPM) tips require complex MEMS processing. Lionix develops tips with channels that allow precise application of droplets as well as tips with multiple probes that allow resistivity mapping with ultra high resolution 
• Chemical sensors : ISFET CHEMFET Clark electrodes
• Functional membranes of Wool, Poly Propylene, celluloses, Anapore, PVDF